Struggling to solder a SOIC chip to a breakout board? Our easy to use stencils made on our precision Laser Cutter using 0.1mm thick transparency sheet makes life a bit more straightforward. ThisSOIC 20-Pin transparency can be used again and again. (We have transparencies which we have used to make many hundreds of boards. Simply clean off the excess solder paste with universal solvent.) Suitable for both narrow and wide packages. SOIC breakout boards available for purchase separately.
Using a soldering iron to solder small surface mount chips can be difficult (or next to impossible) and you can't get access to pads underneath some components. The solution is to use a stencil which has holes where the solder joints are required. With the cut-outs positioned over the component positions, solder paste is applied over the stencil onto the board, the stencil is then removed and components are positioned. By applying heat to the entire board, the solder paste flows around the component pins